1962 Starting construction of the factory
1963 First diodes manufactured
1965 First transistors manufactured
1969 Mass production of IC s started
1971 RPC “Integral” amalgamated
1973 First electronic watches made
1974 Order of October Revolution is awarded for design and manufacture of instruments for space exploration
1977 Manufacture of first memory IC
1978 Manufacture of first microprocessor
1981 Order of Lenin is awarded for design and manufacture of electronic units for Sky Lab terrestrial system
1982 Manufacture of ALS Logic IC
1988 Manufacture of first lap-tops
1990 Phone IC
1992 Bank and market/shop electronic device
1992 First telephone set
1993 Calculator IC
1994 Logic IC of HC/HCT, AC/ACT, 4000B series
1995 IC for one-PCB TV sets of the 6th generation
1998 Smart credit cards
1999 Quality Assurance System is certified for conformance to the requirements of National Standards and International Standards ISO 9001
2000 Sophisticated VLSI for domestic electronic applications
2001 Development of fast and ultra-fast diodes (FRD and UFRD)
2001 Mastering of special IC s for automotive electronics
2002 Development of IC s for ILA8842 TV processor
2003 Establishment of Integral’s offices in China and India
2005 MOSFET type power field-effect transistors mass production start up
2005 VLSI development for “BelKa” satellite
2006 0.5 μm IC mass production start up
2007 0.35 μm LSI development
2007 Starting production of sophisticated products for medical equipment
2008 0.35 μm LSI development
2008 Starting production of sophisticated products for medical equipment
2010 Foundation «INTEGRAL» JSC
2011 Five 0.35 μmproducts were implemented: IN1307, IN1356 - real time clock IC,IZ1325 - high-precision temperature compensatedreal time clock IC,
2011 Products to the amount of USD 4.5 million were manufactured and shipped by the submicron fab
2012 In frames of “BKA” program, manufactured microassemblies and IC assemblies of photosensitive CCD devices for remote sensing satellites
2013 On June 14, 2013, the Ministry of Economy entered “INTEGRAL” Holding into the Public Register of holdings #62
2013 Completion of the design of nonvolatile 1M (128Kx8) FRAM memory
2014 There has been developed and launched into mass production a 16 Mbit CMOS RAM multi-chip module. A set of the 5584-series ICs, 23 types, for space applications has been developed and put into series production. A mobile artificial lung ventilation apparatus has been developed.
2015 K1643RA014 SRAM IC with the capacity of 1 Mb (128Kx8) manufactured under "silicon on insulator" technology. Software and hardware for identification of reinforced concrete structures. LED lighting system for poultry farms with "sunrise-day-sunset" function. A series of near infrared silicon avalanche photodiodes. A set of multiplex switches for cooled and uncooled photodetectors.
2016 IC for a programmable digital thermometers with EEPROM and serial interface. SRAM IC with an information capacity of 4Mbits (512Kb x 8, 256Kb x 16, 12Kb x 32). PS converter IC with LVDS transmitter. LVDS receiver IC with PS converter.
2017 Digital temperature sensor IC for industrial environment. Sets of 3 V and 5 V Manchester code interface transceivers in micro-packages for telecommunication systems.
2018 Development of a set of power supply supervisor ICs with two fixed channels and one configurable channel; a set of power supply supervisor ICs with built-in manual reset and watchdog functions; a 1Mbit single electrically programmable ROM IC with 3.0-3.6V power supply, resistant to special externally acting factors.
2019 Development of application-specific digital temperature sensor IC with "1-Wire" type interface in metal-ceramic package; low-voltage high-speed transceivers of RS 485/422 interface (full duplex), resistant to special externally acting factors; sixteen-bit bidirectional transceiver IC with level conversion capability; measuring operational amplifier IC, resistant to special externally acting factors; 12-bit eight-channel ADC IC with SPI interface.
2020 The "INDUSTRIAL LABORATORY OF ADVANCED TECHNOLOGIES AND MATERIALS" was established.
2021 Development of a series of microcircuits (12 t/n) for the implementation of high-speed data communication links using LVDS standard.