Total area of land sites is 58, 316 ha
Clean rooms:
- class 1 – 195 sq. m.
- class 10 – 950 sq. m.
- class 100 – 1338 sq. m.
- class 1000 – 6452 sq. m.
- class 10000 – 3713 sq. m.
- class 100000 – 14742 sq. m.

Production capacities

WAFER FABS, classes: 1, 10, 100, 1000
Ø200 mm wafer processing with 0,35µm design rules - 12 thousand pcs./year
Ø150 mm wafer processing with 0,8 µm design rules - 120 thousand pcs./year
Ø100 mm wafer processing with 1,5 µm design rules - 355 thousand pcs. /year
Ø100 mm wafer processing with 2,0 µm design rules - 180 thousand pcs. /year

ASSEMBLY LINE, class: 10000 
Semiconductor devices packaging - 30 million pcs./year
ASSEMBLY LINE, class: 100000 
IC packaging - 60 million. pcs./year

Wafer production

100, 150 and 200 mm single-crystal silicon wafers for the manufacture of microelectronic devices: 
- 100 mm diameter for the microelectronic devices with the design rules more than 1,2 µm; 
- 150 mm diameter for the microelectronic devices with the design rules from 1,2 to 0,5 µm;
- 200 mm diameter for the microelectronic devices with the design rules from 0,5 to 0,35 µm .

Capacities:
Single-crystal silicon wafers manufacture for the microelectronic devices: 
- 100 mm diameter - 720 thousand pcs./ year ;
- 150 mm diameter - 120 thousand pcs./ year ;
- 200 mm diameter - 10 thousand pcs./ year.

Technological capabilities

 WAFER FAB TECHNOLOGIES:
CMOS technology, 035 µm, 2 PolySi, 3 Ме
BiCMOS technology, 0,8 µm, 3 PolySi, 2 Ме 
High-voltage CMOS technology, 0,8 µm, 2 PolySi, 1Ме 
Bipolar technologies, 1,5…5 µm, 1-2 Ме
BiCDMOS, DMOS technologies, 0,8…2 µm, 1 Ме
Bipolar superhigh frequency transistors technology 
Schottky diodes technology 
Planar technology for thyristor manufacturing with counter diffusion separation 
Epitaxy-planar and diffusion-planar technologies for the manufacture of silicon semiconductor devices, including high-voltage power transistors
ASSEBMBLY LINE TECHNOLOGIES:
IC assembly into plastic packages of the following types: SO, DIP, P-SOT223-4-1, P-SOT223-4-2, P-TO-5-11, P-TO-5-12, TO-220AB/5, TO-220AB/7, P-TO-220-7-180, P-TO-220-7-230, SIL-3P, SIL-9P, SIL-9MPF, 
DBS-9P, DBS-9MPF, SOT523-1, SIL-13P, SIL-15P, QFP-80, QFP-100
Semiconductor devices assembly:
- into the plastic package types: TO-92, TO-126, TO-218, TO-220, DPACK, D2PACK, IPACK, SOT-23., 
- into the glass-to-metal package types: TO-3, TO-18, TO-72, Case 22A-01.